Modular device system desense reduction

ABSTRACT

A modular device system is provided having a base portable electronic communication device. The base portable electronic communication device has a display side and a reverse side, and one or more antennas being located along one of the device edges. A ground element on the reverse side of the housing is adjacent to the antennas and is grounded to the chassis. A multi-pin connector array on the same side is located adjacent to the ground element and the ground element lies between the connector array and the antennas. The ground element is configured to contact a mating ground element on an add-on module when the module is mated to the base portable electronic communication device.

RELATED APPLICATIONS

This application is a continuation of U.S. Ser. No. 15/174,593, filedJun. 6, 2016, entitled Modular Device System Desense Reduction, which isherein incorporated by reference in its entirety for all that it teacheswithout exclusion of any part thereof.

TECHNICAL FIELD

The present disclosure is related generally to mobile communicationdevices, and, more particularly, to a system and method for mitigatingunwanted RF coupling in a modular portable device system.

BACKGROUND

High-frequency electronic signals are useful with respect to increasingdata rates and hence device response times. However, as data ratesincrease, the inventors have discovered that coupling betweenhigh-frequency lines or connectors and nearby antennas also increases.The effect is two-way, in that signals associated with high frequencyantennas may also couple into nearby high-frequency lines or connectors.

While the present disclosure is directed to a system that can eliminatecertain shortcomings noted in or apparent from this Background section,it should be appreciated that such a benefit is neither a limitation onthe scope of the disclosed principles nor of the attached claims, exceptto the extent expressly noted in the claims. Additionally, thediscussion in this Background section is reflective of the inventors'own observations, considerations, and thoughts, and is not intended tocatalog or summarize any item of prior art. As such, the inventorsexpressly disclaim this section as admitted or assumed prior art.Moreover, the identification or implication herein of a desirable courseof action reflects the inventors' own observations and ideas, andtherefore cannot be assumed to indicate an art-recognized desirability.

SUMMARY

In keeping with an embodiment of the disclosed principles, a modulardevice system is provided having a base portable electroniccommunication device with a chassis and housing and one or more antennaslocated along one of the top, bottom and side edges of the device. Aground element on the reverse side of the housing is adjacent to the oneor more antennas, and a multi-pin connector array is adjacent to theground element such that the ground element lies between the connectorarray and the antennas.

In another embodiment, a modular device connection system is providedfor physically and electrically connecting an electronic module to aportable electronic communication device. A ground element is providedadjacent to the device antennas, the ground element being grounded to achassis of the device. A multi-pin connector array is located adjacentto the ground element such that the ground element lies between theconnector array and the one or more antennas.

In yet another embodiment, a modular electronic device system isprovided having a portable electronic device with a device groundelement on the device housing adjacent to one or more device antennas.The device ground element is grounded to the device chassis, and liesbetween the antennas and a device multi-pin connector array. Similarly,a mating electronic module has a multi-contact module ground elementproviding a module ground. Similarly, a module multi-pin moduleconnector array is provided and the multi-contact module ground elementand module multi-pin module connector array are configured and locatedto electrically connect to the device ground element and the devicemulti-pin connector array respectively when the electronic module ismated to the portable electronic device.

Other features and aspects of embodiments of the disclosed principleswill be appreciated from the detailed disclosure taken in conjunctionwith the included figures.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

While the appended claims set forth the features of the presenttechniques with particularity, these techniques, together with theirobjects and advantages, may be best understood from the followingdetailed description taken in conjunction with the accompanying drawingsof which:

FIG. 1 is a simplified schematic of an example configuration of devicecomponents with respect to which embodiments of the presently disclosedprinciples may be implemented;

FIG. 2 is view of a first device and a second device, showing the backof the first device and the back of the second device in accordance withan embodiment of the disclosed principles;

FIG. 3 is a side view of a phone and module in accordance with anembodiment of the disclosed principles;

FIG. 4 is a subassembly view showing a portion of the rear housing intop and bottom views in accordance with an embodiment of the disclosedprinciples;

FIG. 5 is a simplified view of a connector arrangement for connecting toa continuous debar in accordance with an embodiment of the disclosedprinciples;

FIG. 6 is a data plot showing the isolation effect, in dB, of employinga debar of 44 mm in a modular configuration in accordance with anembodiment of the disclosed principles; and

FIG. 7 is a data plot showing the isolation effect, in dB, of employinga debar of 27 mm in a modular configuration in accordance with anembodiment of the disclosed principles.

DETAILED DESCRIPTION

Before presenting a fuller discussion of the disclosed principles, anoverview is given to aid the reader in understanding the later material.As noted above,

Within the modular concept conceived by the inventors, an external unit(“mod” or “module”) is configured to connect to a base unit (e.g., amobile phone) through multiple exposed connectors to enhance userexperience. Modules may provide enhanced imaging, entertainment,presentation and other functionality. In an embodiment, the phone mayalso connect to docks, computers, tablets, etc. using the same connectorconfiguration

The communication between the phone and the module may happen at varyingspeeds, from DC up to 5 Gbps or higher. These high speed connectors arein close proximity of the transmit and receive antennas of the device.Hence attaching a mod to the device may generate noise from the exposedconnectors, which elevates a noise floor used to separate noise fromsignal, and thus may lead to desensitization of the phone's cellularreceivers. This phenomenon may be referred to herein as “desense.” Inaddition, interference from the cellular transmit antennas may cause thedevices to throttle data transfer through the exposed mod connectors dueto reverse desense.

Embodiments of the disclosed principles mitigate desensitization of thephone RF/Antenna system from unshielded high speed pin connectionsbetween phone and mod by implementing a ground wall is linked across thephone and the mod. This may be implemented by placing a metal bar(sometimes referred to herein as a “debar’) on the phone face, with thedebar being tied to the reference ground on the phone's PCB (printedcircuit board). The debar may extend beyond the width of the connectorpin array, and in an embodiment extends outside of the width of theconnector pin array by about 8 mm on either side. It will be appreciatedthat the length of the debar may be longer or shorter depending onspecific design features in a given instance.

The debar separates the mod connector array from the nearest antennas,e.g., the bottom antennas. A similarly metal bar is tied to the mod'sPCB. In a further embodiment, these two bars are connected to each otherthrough an array of pogo pins (e.g., about 8 of them, although a lesseror greater number may be used depending on specific design features in agiven instance. It will be appreciated that with respect to theconnector array, it is not important which device includes which of thepogo pins and debar, or which contains which of the electrical connectortypes. As will be shown later, use of the debar system significantlyreduces interference and thus reduces desense.

Additionally, a metal plate may be placed over the connector array withholes located to allow connector pins to pass through for additionalisolation. The metal plate is electrically connected via solder orconductive adhesive to the AMP PCB ground chassis, and may conductivelycontact the phone metal backing when the AMP is attached to phone,thereby filling the non-metal gap around the connector pins withshielding metal, but not forming an overlapping ground shield into thephone (unlike USB or HDMI connectors), thereby maintaining ID integrityof the back of the phone.

With this overview in mind, and turning now to a more detaileddiscussion in conjunction with the attached figures, the techniques ofthe present disclosure are illustrated as being implemented in asuitable computing environment. The following device description isbased on embodiments and examples of the disclosed principles and shouldnot be taken as limiting the claims with regard to alternativeembodiments that are not explicitly described herein. Thus, for example,while FIG. 1 illustrates an example mobile device within whichembodiments of the disclosed principles may be implemented, it will beappreciated that other device types may be used.

The schematic diagram of FIG. 1 shows an exemplary component group 110forming part of an environment within which aspects of the presentdisclosure may be implemented. In particular, the component group 110includes exemplary components that may be employed in a devicecorresponding to the first device or phone, and the second device. Itwill be appreciated that additional or alternative components may beused in a given implementation depending upon user preference, componentavailability, price point, and other considerations.

In the illustrated embodiment, the components 110 include a displayscreen 120, applications (e.g., programs) 130, a processor 140, a memory150, one or more input components 160 (user input receiver) such asspeech and text input facilities, and one or more output components 170such as text and audible output facilities, e.g., one or more speakers.In an embodiment, the input components 160 include a physical or virtualkeyboard maintained or displayed on a surface of the device. In variousembodiments motion sensors, proximity sensors, camera/IR sensors andother types of sensors may be used to collect certain types of inputinformation such as user presence, user gestures and so on.

The processor 140 may be any of a microprocessor, microcomputer,application-specific integrated circuit, and like structures. Forexample, the processor 140 can be implemented by one or moremicroprocessors or controllers from any desired family or manufacturer.Similarly, the memory 150 may reside on the same integrated circuit asthe processor 140. Additionally or alternatively, the memory 150 may beaccessed via a network, e.g., via cloud-based storage. The memory 150may include a random access memory (i.e., Synchronous Dynamic RandomAccess Memory (SDRAM), Dynamic Random Access Memory (DRAM), RAMBUSDynamic Random Access Memory (RDRM) or any other type of random accessmemory device or system). Additionally or alternatively, the memory 150may include a read only memory (i.e., a hard drive, flash memory or anyother desired type of memory device).

The information that is stored by the memory 150 can include programcode associated with one or more operating systems or applications aswell as informational data, e.g., program parameters, process data, etc.The operating system and applications are typically implemented viaexecutable instructions stored in a non-transitory computer readablemedium (e.g., memory 150) to control basic functions of the electronicdevice. Such functions may include, for example, interaction amongvarious internal components and storage and retrieval of applicationsand data to and from the memory 150.

Further with respect to the applications 130, these typically utilizethe operating system to provide more specific functionality, such asfile system services and handling of protected and unprotected datastored in the memory 150. Although some applications may providestandard or required functionality of the user device 110, in othercases applications provide optional or specialized functionality, andmay be supplied by third party vendors or the device manufacturer.

Finally, with respect to informational data, e.g., program parametersand process data, this non-executable information can be referenced,manipulated, or written by the operating system or an application. Suchinformational data can include, for example, data that are preprogrammedinto the device during manufacture, data that are created by the deviceor added by the user, or any of a variety of types of information thatare uploaded to, downloaded from, or otherwise accessed at servers orother devices with which the device is in communication during itsongoing operation. The device 110 also includes a camera module 180,which is linked to a device camera.

In an embodiment, a power supply 190, such as a battery or fuel cell, isincluded for providing power to the device 110 and its components. Allor some of the internal components communicate with one another by wayof one or more shared or dedicated internal communication links 195,such as an internal bus.

In an embodiment, the device 110 is programmed such that the processor140 and memory 150 interact with the other components of the device 110to perform certain functions. The processor 140 may include or implementvarious modules and execute programs for initiating different activitiessuch as launching an application, transferring data, and togglingthrough various graphical user interface objects (e.g., toggling throughvarious display icons that are linked to executable applications).

Applications and software reside on a tangible non-transitory medium,e.g., RAM, ROM or flash memory, as computer-readable instructions. Thedevice 110, via its processor 140, runs the applications and software byretrieving and executing the appropriate computer-readable instructions.

Turning to FIG. 2, this figure illustrates a simplified view of thephone 200 and the module 201, showing the back 203 of the phone 200 andthe mating front 205 of the module 201 in accordance with an embodimentof the disclosed principles. In the illustrated example, each device200, 201 includes a connector array 207, 209. Although each connectorarray 207, 209 is shown as a 16-pin connector array, it will beappreciated that other numbers of pins may be used. Although notdetailed in the figure, one of the connector arrays 207, 209 willtypically include spring-loaded male pins while the other 207, 209 willtypically include corresponding female sockets or contacts. The groundeddebar discussed above can be seen in FIG. 2 as element 217, and themating pogo connectors as element 213. The phone 200 also includes oneor more antennas 231, 233.

In the illustrated embodiment, an alignment socket 211 is includedwithin the connector array 207 on the phone 200, for mating with amatching alignment pin 215 on the module 201. A third alignment point isprovided by a camera protrusion 219 on the phone 200, which isconfigured and located to fit with a mating circular opening 221 in themodule 201. In an embodiment, the camera protrusion 219 contains themain camera of the device 200 as well as one or more flash LEDs. In anembodiment, the camera protrusion 219 also includes a laser range-finderfor faster focus of the main camera.

As noted above, although other camera protrusion shapes are usable andare contemplated herein, a circular shape will be used for the sake ofexample. Depending upon tolerances in a given implementation, anon-circular camera protrusion may provide a degree of rotationalalignment as well and may limit or eliminate the need for otheralignment features.

In an embodiment, a set of magnets 223, 225, 227, 229 is embedded in thefront of the module 201. These magnets 223, 225, 227, 229 may beretained on an inner surface of this cosmetic sheet. These magnets maybe encased in a steel shroud such that the magnetic field is focused toone side of the magnet assembly rather than extending to both sides. Inan embodiment, these magnets 223, 225, 227, 229 attract the steelsurface of the back 203 of the phone 200 so as to hold the devices 200,201 together once the devices 200, 201 are in close proximity. Themagnets 223, 225, 227, 229 may be of ceramic, neodymium or other type.

FIG. 3 is a side view of the phone 200 and the module 201 in accordancewith an embodiment of the disclosed principles. As briefly shown in theside view of FIG. 3, when the phone 200 and the module 201 are dockedtogether, the camera protrusion 219 fits into the mating opening 221 inthe module 201. In addition, the contact array 207 of the phone 200mates with the contact array 209 of the module 201 in thisconfiguration.

Ideally the combined device acts as one, using the connections providedby the mating contact arrays 207, 209. In particular, the contact arrays207, 209 are used in various embodiments to exchange data, commands,power, control signals and so on.

FIG. 4 is a subassembly view showing a portion of the rear housing 401in top and bottom views, in an embodiment wherein the debar 217 isski-booted/toed into the rear housing 401 to have multiple directcontact points grounding to the main PCB.

FIG. 5 is a detail view of the pogo connectors 213 and a connector arrayshroud 501 in accordance with an embodiment of the disclosed principles.As can be seen, the pogo connectors 213 are positioned to contact thedebar 217 (FIG. 2) when the phone 200 and module 201 are mated together.The grounded shroud 501 partially surrounds each connector pin in thearray 209 (FIG. 2), providing additional shielding.

As noted above, the use of a debar, as described herein or similar, cansignificantly increase isolation of the antennas and the pins of theconnector arrays. FIG. 6 is data plot showing the isolation effect, indB, of employing a debar of 44 mm in a modular configuration asdescribed herein. In particular, a first plot 601 shows the originallevel of isolation and a second plot 603 shows the level of isolationachieved using the debar. As can be seen, use of the debar increasesisolation by more than 5 dB throughout the range from about 700 MHz toabout 870 MHz.

FIG. 7 is data plot showing the isolation effect, in dB, of using adebar of a different length than that used in the plot of FIG. 6, namelya debar of 27 mm. The first plot 701 shows the original level ofisolation and a second plot 703 shows the level of isolation achievedusing the debar of 27 mm. In this case, the isolation effect is worsethan with the longer debar.

It will be appreciated that a system and method for improved mobilephone isolation for a modular system have been described herein.However, in view of the many possible embodiments to which theprinciples of the present disclosure may be applied, it should berecognized that the embodiments described herein with respect to thedrawing figures are meant to be illustrative only and should not betaken as limiting the scope of the claims. Therefore, the techniques asdescribed herein contemplate all such embodiments as may come within thescope of the following claims and equivalents thereof.

We claim:
 1. A modular device system including a base portableelectronic communication device comprising: a chassis; a printed circuitboard (PCB); a housing at least partially encompassing the chassis,having a display side and a reverse side, and having top, bottom andside edges, wherein one or more antennas are located along one of thetop, bottom and side edges; a ground element exposed on the reverse sideof the housing and being adjacent to the one or more antennas, theground element being grounded to the chassis; a multi-pin connectorarray on the reverse side and being adjacent to the ground element suchthat the ground element lies between the connector array and the one ormore antennas, the multi-pin connector array being configured andlocated to electrically connect to a mating array on a module devicewhen the module device is mated to the base portable electroniccommunication device; and one or more ground contacts linking the PCB tothe chassis, providing a direct ground path between chassis and boardground.
 2. The modular device system in accordance with claim 1, whereinthe ground element is an elongated metal bar positioned to mate with oneor more grounded contacts on the module device when the module device ismated to the base portable electronic communication device, such thatthere is a continuous ground path from the base portable electroniccommunication device ground to the modular device ground.
 3. The modulardevice system in accordance with claim 2, wherein the elongated metalbar is positioned between two rows of pins in the multi-pin connectorarray.
 4. The modular device system in accordance with claim 2, whereinthe elongated metal bar comprises a plurality of tabs configured toelectrically connect between the chassis and a back plate of thehousing.
 5. The modular device system in accordance with claim 2,wherein the elongated bar is a spring loaded to apply outward pressureon the metal plate when the module device is mated to the base portableelectronic communication device.
 6. The modular device system inaccordance with claim 1, wherein the ground element comprises a line ofgrounded contacts positioned to mate with an elongated metal bar on themodule device when the module device is mated to the base portableelectronic communication device.
 7. The modular device system inaccordance with claim 1, wherein the ground element comprises a groundring encompassing the multi-pin connector array of the base portableelectronic communication device.
 8. The modular device system inaccordance with claim 7, wherein the ground ring is configured toconnect to a ring of pogo pins on the modular device when the moduledevice is mated to the base portable electronic communication device. 9.The modular device system in accordance with claim 1, wherein the one ormore antennas are located along one of the top edge and bottom edge ofthe housing.
 10. The modular device system in accordance with claim 1,wherein the one or more antennas are located along one of the side edgesof the housing.
 11. The modular device system in accordance with claim1, further comprising a metal plate overlying the multi-pin connectorarray and having a plurality of holes there though such that the pins ofthe multi-pin connector array remain exposed on the reverse side of thehousing.
 12. The modular device system in accordance with claim 11,wherein the plurality of holes are configured to leave space between asubset of the pins and the metal plate.
 13. The modular device system inaccordance with claim 11, wherein the metal plate is electricallyconnected to the chassis.
 14. The modular device system in accordancewith claim 1, further comprising at least one puck on one of the moduledevice and the base portable electronic communication device and atleast one magnet on the other of the module device and the base portableelectronic communication device, wherein the at least one puck and theat least one magnet are positioned such that they are in contact andform a ground path when the module device is mated to the base portableelectronic communication device.
 15. The modular device system inaccordance with claim 1, further comprising a conductive adhesiveforming at least a portion of a ground shield between the pins and oneor more antennas of the base portable electronic communication device.